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    Core Technologies

    Core Technologies

    In order to achieve high-end performance with low SWaP and affordable products, SCD is vertically integrated with the following in-house technologies and capabilities:

    • Large volume R&D and manufacturing infrastructure for diverse detector technologies based on various semiconductor materials: HgCdTe, InSb, InGaAs, InAsSb, InAs/GaSb T2SL, and VOx micro-bolometers
    • More than 33,000 ft² of clean rooms with automated FAB process and infrastructure.
    • Design and simulation of semiconductor devices including advanced Bandgap Engineering
    • Material simulation, growth, and characterization using Liquid Phase Epitaxy (LPE) and Molecular Beam Epitaxy (MBE) technologies
    • Micro-electronics semiconductor processing technologies and FIB based failure analysis
    • Analog and digital VLSI design based on advanced CMOS technologies. Unique ROIC solutions for signal processing and advanced imaging functionalities
    • Packaging design and integration for infrared detectors: Cooler, Dewar and Integrated optics in cryogenically cooled detectors. Metallic, Ceramic, PCB and Wafer Level Packaging (WLP) for uncooled and TEC operated detectors
    • Stray light analysis and Environmental conditions analysis and test
    • Electro-optical characterization from test device level up to fully integrated FPA and IDCA
    • Image processing algorithms implemented in low SWaP video engines

    SCD has gained worldwide recognition of its innovative and high quality products; its revolutionary methods enable creative approaches to meeting the challenging requirements of space imaging


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