As part of our core technologies, we have full control of sensing materials design and manufacturing for IR radiation.

Our Sensing materials include:

• InSb that is cooled to cryogenic temperatures and used for sensing in the SWIR-MWIR band.
  
  
• In addition, for this waveband, we invented new sensing materials that operate at much higher temperatures while keeping the same electro-optical performance. These are our patented HOT XBN and HFM barrier diodes designed based on band gap engineering techniques and produced in our FAB using MBE machines.
  
  
• For the Vis-SWIR band we are using uncooled technology of detection based on InGaAs material. Here, we perfected the production processes to yield high sensitivity, uniformity and operability detectors. Furthermore, we introduced in this line of products unique capabilities of detection, at pixel level. In this case, each pixel is producing in addition to the image data, also detection information such as laser pulse detection, range finding and event detection. Hence, our ROIC CMOS processors are a state of the art technology not only in the IR field, but also in the global CMOS product design.
  
  
• For the LWIR band, we have two types of technologies: The VOx microbolometer is an uncooled technology that we developed and manufacture to be used for mass distribution low SWaP-C products. In parallel, we patented a cooled LWIR technology based on T2SL structures having very high sensitivity and enabling the production of affordable staring arrays.

Chips bonding: The majority of our FPAs utilize a dual-chip solution, merging the sensing material chip with a CMOS ROIC chip. For this hybridization, we employ flip chip bonding technology, allowing us to produce arrays up to 5 million pixels with a precision as fine as 5µm.

FPA Packaging: We package our FPA chips within SCD's FAB, using designs customized for each product based on specific sensor requirements. Our methods encompass a variety of technologies including Metal Packaging, Ceramic Packaging, and Wafer Level Packaging. These techniques ensure the longevity of the vacuum inside the chip enclosure and offer resistance to intense vibrations and shocks, all while accommodating a broad spectrum of operating temperatures.

Integral Optics: Several of our products incorporate a complete optical system within the FPA package. This patented technology enhances the optical performance of cooled detectors, all within a remarkably compact design.

Electronics and image processing: The data output of our products is digital directly from the FPA level. This output data is channeled to client systems through standard interfaces, including Camera Link, CoaXPress, HD SDI, or MIPI. This transmission is facilitated via electronic boards we've designed, which house tailored software for both FPA management and image data processing. The degree of image processing varies, ranging from mere raw data to fully refined and processed visuals, customizable to user preferences.